Lego developed a custom ASIC chip that allows its new Ssmart Bricks to pick up on signals from surrounding Smart Tags that ...

Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...

Harvard's free programming classes teach you how to think, debug, and adapt in an AI-driven world where knowing code matters more than ever.

Abstract: This paper addresses the direction-of-arrival (DOA) estimation problem for non-circular signals in nested arrays through a block tensor sparse representation (TSR) framework. By establishing ...

Pipeline for calculating centromeric blocks from TRASH repeat-array outputs. Merges tandem-repeat arrays into continuous blocks, applies percentile filtering (25–50–25 + 10% rescue), computes ...