Samsung last month unveiled a SOCAMM2 LPDDR5-based memory module designed specifically for AI data center platforms.

SK hynix showcases its next-gen memory solutions for AI at CES 2026: with 48GB HBM4, SOCAMM, LPDDR6, and more for future AI ...

SK hynix Inc. (or "the company", announced today that it will open a customer exhibition booth at Venetian Expo and showcase ...

SK hynix said Tuesday it is unveiling its next generation of artificial intelligence memory chips — including a 16-layer HBM4 ...

SK hynix unveiled its next generation of artificial intelligence memory chips, including a 16-layer HBM4, at CES 2026 in Las Vegas on Tuesday. The chipmaker opened a customer-only exhibition booth to ...

Nvidia CEO Jensen Huang gave an outlook on the upcoming AI server DGX Vera Rubin with in-house ARM processor cores and new ...

SK Hynix will showcase a lineup of next-generation high-bandwidth memory (HBM) products at CES2026 in Las Vegas, U.S., aiming ...

ProLogium Technology, a leader in solid-state battery R&D and mass production, today announced that it will co-exhibit with FEV Group, a globally leading innovation driver for mobility solutions and ...

The GPU made its debut at CES alongside five other data center chips. Customers can deploy them together in a rack called the Vera Rubin NVL72 that Nvidia says ships with 220 trillion transistors, ...

Santa Barbara-based Lucidean, a deep-tech startup working at the cutting edge of optical interconnect technologies, has ...

If you’re reading this, that means you’ve successfully made it through 2025! Allow us to be the first to congratulate you — ...