Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...

Abstract: Given the prospects of the low-altitude economy (LAE) and the popularity of autonomous aerial vehicles (UAVs), there are increasing demands on monitoring flying objects at low altitude in ...

If you’re going online to buy some last-minute gifts this holiday season, there’s a chance the price you pay will be influenced by what’s known as “surveillance pricing.” Some retailers are using ...

From daily news and career tips to monthly insights on AI, sustainability, software, and more—pick what matters and get it in your inbox. Explore The Most Powerful Tech Event in the World with ...

In a hangar-like building in Louisville, Colorado, outside Denver, crumpled plastic bottles, cans and other scraps were strewn across a giant conveyor belt. But you know what they say about one man’s ...

We describe a concrete device roadmap towards a fault-tolerant quantum computing architecture based on noise-resilient, topologically protected Majorana-based qubits. Our roadmap encompasses four ...