Abstract: Through-silicon via (TSV) has attracted much attention due to its numerous advantages, including high-density interconnection, low power consumption, and wide bandwidth. When signals are ...
Abstract: It is essential to measure the transmit and receive capabilities of the millimeter-wave (mmWave) phased arrays in the beam peak direction, which are represented by the metrics effective ...
When using Multimodal metrics (e.g., MultimodalFaithfulnessMetric), the internal logic sometimes passes a single string prompt to the model's generate or a_generate method. In ...
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